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Prof Richard Fu

Professor

Department: Mathematics, Physics and Electrical Engineering

Richard Fu (1)

He was a Reader in Thin Film Centre in University of West of Scotland, Glasgow, UK, and a lecturer in Heriot-Watt University, Edinburgh, UK. He obtained his PhD degree from Nanyang Technological University, Singapore, and then worked as a Research Fellow in Singapore-Massachusetts Institute of Technology Alliance, and a Research Associate in University of Cambridge.

 

He has extensive experience in smart thin film/materials, biomedical microdevices, energy materials, lab-on-chip, micromechanics, MEMS, nanotechnology, sensors and microfluidics. He has established a worldwide reputation from his pioneer research work on shape memory films, piezoelectric thin films, nanostructured composite/films for applications in MEMS, sensing and renewable energy applications.

His research has been funded by Engineering and Physics Science Research Council (EPSRC), Royal Society, Royal Academy of Engineering, Carnegie Trust, UK Fluidic Network, Royal Society of Edinburgh, Scottish Government, Scottish Union Physics Alliance (SUPA), Nuffield Foundation, Innovate UK/Knowledge Transfer Partnership (KTP), AWE-UK, EU-Erasmus, Scottish Sensor System Centre/CENSIS, Scottish Funding Council and National Science Foundation of China, etc.

 

He published over 350 science citation index (SCI) journal papers (including Nat. Comm., Prog. Mater Sci, Nano Energy, Nano Lett., Chem. Mater., J Mater Chem A, Advanced Drug Delivery Review, etc.) 2 books, 20 book chapters, and over 120 conference papers. His current SCI H-index is 42 with over 6900 citations (up to Oct 2018), and his Google scholar H-index is 53.

He has extensive teaching experience in three UK universities with the teaching modules covering Mechanical Engineering, Material Science/Engineering, Physics, Renewable Energy, and Electrical Engineering. He has actively involved in departmental/institutional development in the past 10 years, and served various duties in teaching, research, social and networking activities.

 

He is associate editor/editorial board members for seven international journals including Scientific Report. He is regular journal paper reviewers for more than 40 journals, and has co-organized 12 international conferences worldwide, and co-edited eight special issues for journals.

He is now served as the Regional President of International Thin Film Society, and Regional Secretary of Taiwan Thin Film Society, and Committee Member of Chinese Society of Heat Treatment and Metallurgy/Chinese Society of Surface Engineering.

Richard Fu’s ResearchGate website:

Richard Fu’s Northumbria Research Link:

Richard Fu's Google Scholar

Richard Fu’s Researcher ID is D-2723-2009

Research Fu’s research ID is: URL

Richard Fu’s ORCID No is: ORCID

Campus Address

Room E409, Ellison Building
Faculty of Engineering and Environment
Northumbria University, Newcastle Upon Tyne
NE1 8ST UK

Qualifications

  • Technologies PhD June 30 1999
  • Member Institute of Electrical & Electronic Engineers (IEEE) 2007
  • Member Institute of Physics (IOP) 2007

Key Publications

  • Please visit the Pure Research Information Portal for further information
  • A ‘cross-relaxation effects’ model for dynamic exchange of water in amorphous polymer with thermochemical shape memory effect, Liu, C., Lu, H., Li, G., Hui, D., Fu, Y. 21 Aug 2019, In: Journal of Physics D: Applied Physics
  • A Fully Integrated Biosensing Platform Combining Acoustofluidics and Electromagnetic Metamaterials, Zahertar, S., Wang, Y., Tao, R., Xie, J., Fu, R., Torun, H. 19 Aug 2019, In: Journal of Physics D: Applied Physics
  • 3D patterning/manipulating microparticles and yeast cells using ZnO/Si thin film surface acoustic waves, Tao, X., Dai Nguyen, T., Jin, H., Tao, R., Luo, J., Yang, X., Torun, H., Zhou, J., Huang, S., Shi, L., Gibson, D., Cooke, M., Du, H., Dong, S., Luo, J., Fu, Y. 17 Aug 2019, In: Sensors and Actuators B: Chemical
  • Two-Dimensional van der Waals Materials with Aligned In-Plane Polarization and Large Piezoelectric Effect for Self-Powered Piezoelectric Sensors, Dai, M., Wang, Z., Wang, F., Qiu, Y., Zhang, J., Xu, C., Zhai, T., Cao, W., Fu, Y., Jia, D., Zhou, Y., Hu, P. 14 Aug 2019, In: Nano Letters
  • Ultrasensitive biosensor based on magnetic microspheres enhanced microfiber interferometer, Kumar, R., Leng, Y., Liu, B., Zhou, J., Shao, L., Yuan, J., Fan, X., Wan, S., Wu, T., Liu, J., Binns, R., Fu, Y., Ng, W., Farrell, G., Semenova, Y., Xu, H., Xiong, Y., He, X., Wu, Q. 6 Aug 2019, In: Biosensors and Bioelectronics
  • Cooperative principle in multiple glass transitions and strain relaxations of thermochemically responsive shape memory polymer, Wang, X., Lu, H., Wu, N., Hui, D., Chen, M., Fu, Y. 1 Aug 2019, In: Smart Materials and Structures
  • Enhanced electrochemical performance of CuCo2S4/carbon nanotubes composite as electrode material for supercapacitors, Li, H., Li, Z., Sun, M., Han, S., Cai, C., Shen, W., Liu, X., Fu, Y. 1 Aug 2019, In: Journal of Colloid and Interface Science
  • W-Cu Composites Reinforced by Copper Coated Graphene Prepared using Infiltration Sintering and Spark Plasma Sintering: a comparative study, Zhou, K., Chen, W., Wang, J., Yan, G., Fu, Y. 1 Aug 2019, In: International Journal of Refractory Metals and Hard Materials
  • Highly efficient and stable planar heterojunction solar cell based on sputtered and post-selenized Sb2Se3 thin film, Tang, R., Zheng, Z., Su, Z., Li, X., Wei, Y., Zhang, X., Fu, Y., Luo, J., Fan, P., Liang, G. 26 Jul 2019, In: Nano Energy
  • Modelling strategy for enhanced recovery strength and a tailorable shape transition behavior in shape memory copolymers, Wang, X., Wei, J., Lu, H., Lau, D., Fu, R. 24 Jul 2019, In: Macromolecules

PGR Supervision

  • Tiancheng Xia Start: 11/03/2019
  • Sameer Ahmad Hasan Flexible ZnO film based acoustic wave devices for environmental and biomedical sensing applications Start: 01/10/2015
  • Jethro Vernon Start: 01/10/2018
  • Manuel Bogner Thermal Conductivity Measurements of Thin Films using a Novel 3 Omega Method Start: 06/06/2015


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